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Applicable to CMP and wet processing equipment that must withstand exposure to acids, alkalis, and hydrogen peroxide while maintaining high cleanliness standards.
It is specifically designed for semiconductor wet processing and Chemical Mechanical Planarization (CMP) equipment that requires high chemical resistance and strict contamination control.
The material offers exceptional chemical compatibility, allowing it to withstand continuous exposure to strong acids, alkalis, and oxidizing agents like hydrogen peroxide without degradation.
High cleanliness prevents micro-contamination and particle generation in semiconductor manufacturing, ensuring high wafer yield and preventing process defects.
Yes, components can be customized to match the precise dimensions and specifications of various OEM CMP and wet bench systems.
Thanks to their engineered material properties, these components offer extended service lifespans and reduced maintenance cycles even under constant exposure to hydrogen peroxide and acids.











